Numerical study of nanocomposite phase change material-based heat sink for the passive cooling of electronic components

The current two-dimensional (2D) numerical study presents the melting phenomenon and heat transfer performance of nanocomposite phase change material (NCPCM) based sink. Metallic nanoparticles (copper: Cu) different volume fractions 0.00, 0.01, 0.03, 0.05 were dispersed in RT–28HC, used as a PCM. Transient simulations with conjugate melting/solidification schemes formulated using finite–volume–method (FVM). thermal process NCPCM filled sink evaluated through time, storage capacity, density, rate density. results showed that addition Cu nanoparticles, was increased time reduced. reduction obtained ? 1.36%, 1.81%, 2.56% at 0.05, respectively, compared 0.00 higher capacity enhancement 1.87% lower 7.23% density 0.01 fraction. 2.86%, 2.19% 1.63%; 6.33%, 21.05% 31.82% fraction respectively. suggest has rate, which is preferable for passive cooling electronic components.